Massively parallel computing in nano-VLSI interconnect modeling and lithography simulation
نویسندگان
چکیده
منابع مشابه
Three-Dimensional Interconnect Modeling for Nano-Scale VLSI Technologies
Designing high performance very large scale integration (VLSI) circuits has become more challenging than ever due to deep sub-micron effects and accelerating time-to-market cycles. With the increasing interconnect delay dominance and strong coupling effects, a small change in the design can cause new timing violations and result in design iterations. At the same time, the industry trend of inte...
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ژورنال
عنوان ژورنال: SCIENTIA SINICA Informationis
سال: 2016
ISSN: 1674-7267
DOI: 10.1360/n112016-00085